Improve heat transfer between compatible components and cooling solutions with Thermalright TF4 Thermal Paste. Designed for PC builders, enthusiasts and technicians, this 4 g thermal compound helps create an effective thermal interface by filling microscopic surface gaps between a processor or other heat-generating component and its cooler. Its high 9.5 W/m·K thermal conductivity supports efficient heat dissipation, while the non-electrically conductive formulation adds confidence during careful application around sensitive electronics. With a broad operating temperature range from -50°C to 240°C, TF4 is a practical choice for new system builds, cooler installations and routine thermal paste replacement.
Key Features:
High 9.5 W/m·K thermal conductivity for effective heat transfer
Helps fill microscopic gaps between components and cooling surfaces
Non-electrically conductive formulation for added application confidence
4 g tube provides paste for system builds and maintenance
Wide -50°C to 240°C usable temperature range
Low thermal impedance of less than 0.0068°C·cm²/W
Grey thermal compound
Technical Specifications:
Model: THR01489
Thermal Conductivity: 9.5 W/m·K
Thermal Impedance: <0.0068°C·cm²/W
Usable Temperature Range: -50°C to 240°C
Content: 4 g
Colour: Grey
Specific Gravity at 25°C: 2.7
Electrical Conductivity: No
In the Box:
Thermalright TF4 4g Thermal Paste



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